Archive for July 17th, 2015
Leaked Images Show iPhone 6s Plus Rear Shell with Minor Changes
Several new images showing something what appears to be a rear shell for the upcoming iPhone 6s Plus have recently appeared on the Internet. Future Supplier blog reporters claim the part is nearly identical in size and shape to the rear shell of the iPhone 6 Plus. Probably the only really noticeable difference is the location of the holes for screws that hold the loud speaker module. Apart from that, “the 6S Plus’ rear housing is stronger”. Looks like the guys from Cupertino did their best to make the smartphone strong enough not to bend in your pocket. Well, that’s what we all expected, right?
Samsung and TSMC Start Production of A9 Chips for Next-Gen iPhones
According to the latest report from usually-reliable DigiTimes reporters, Apple partners, Samsung and Taiwan Semiconductor Manufacturing Company, have recently started the mass production of the A-series chips for the upcoming iPhone 6s and iPhone 6s Plus, which are expected to be officially released as soon as in September. In addition to the processors, TSMC will also supply Apple with fingerprint sensors and audio chips for the next-generation handsets, sources claim. The start of mass production of one of the most important iPhone component indicates that Apple plans to release new devices this fall, in accordance with the usual release schedule. It should be noted, however, that TSMC is currently not working at full capacity.
Hackers Release TaiG 2.4.3 Beta with Stability Enhancements
As you know, the hackers from the Taig team has been incredibly active over the last few weeks. Just several hours ago, they have