News tagged ‘internals’

Gizmodo decided to take apart the future iPhone 4G before they will return it to Apple. It is interesting just to see what's inside. And this is one more confirmation that this phone is from Apple. There are three separate places, inside the case, where APPLE is written prominently.

Here is a photo gallery of iPhone's internals:

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Here are photos of iPhone 3G S internals by anandtech:

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Here are some cool photos of iPhone 3G in X-Ray. You can compare them with internal photos: IPhone 3G internals, More IPhone 3G internals photos.

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After breaking apart iPod Touch folks from iFixIt disassembled iPod Nano:

Separately, iFixIt dissected the new iPod nano and observed that the unit's 3.2 mm wide dock connector "looks pretty big compared to the iPod" itself, making it unlikely that Apple will be able to slim down player any further without developing a new dock connector.

A particularly surprising find was that the new nano uses a real piece of curved glass, "about .7 mm thick on the edges, and 1.7 mm thick in the middle," to cover the LCD display. The glass is said to be completely separate from the player's anodized aluminum enclosure, with nothing holding it in place outside the force of the adjacent components.

The LCD itself "is actually almost exactly the same size as the 3rd Gen Nano LCD," iFixIt said, with the only difference being a resolution of 240x320 rather than 320x240.

Among the nano's internal components are a Apple-branded ARM processor manufactured by Samsung in July with on-board DRAM on-package, three other small Apple-branded chips of unknown origin, and an 8 GB Toshiba flash chip. "Unfortunately, the battery is soldered to the logic board," iFixIt said. "Replacing the Nano's battery isn't going to be easy."

via appleinsider and ifixit

The folks at iFixIt received a brand new iPod Touch, which they disassembled right away.

Both the touch's 3.5-inch LCD display as well as its Lithium-ion polymer battery are held in place with strips of double-sided tape. The WiFi antenna and circuitry, which are located at the top of the unit, are connected to the main logic board by wide orange cable that were designed to prevent external noise from interfering with the digital signals as they travel along the device, iFixIt says.

The specialty online reseller, which offers replacement parts for Macs and iPods, was particularly excited by its discovery of an unpublicized Broadcom BCM4325 Bluetooth chip within the device. The particular chipset supports BT2.1+EDR, and is necessary for the touch's built-in support of Nike+ iPod technology. It's unclear, however, whether the chip supports A2DP, which would pave the way for Apple and third-party developers to introduce stereo headphones for the player.

iFixIt also discovered brown rectangular component centered about three quarters of the way down the touch's logic board, which is suspected to be the device's speaker. Other discoveries include a 3.7 V Lithium-ion polymer battery with part number 616-0404, NAND flash memory from Micron with part number 29F64G08TAA, and an Apple-branded Samsung-manufactured ARM processor with SDRAM that's similar to the one employed by the iPhone.

via appleinsider and ifixit

Foxconn, the Taiwanese electronics giant that produces the iPhone 3G for Apple, has ramped up production to 800,000 units per week, says a source close to Apple with direct knowledge of the numbers.

Apple sold just 6 million of its first generation iPhones. Foxconn factories will be able to ramp production up significantly over time, says our source. But at current sell rates, the company is producing iPhones at a run rate of over 40 million units per year, well beyond early estimates of demand for the product of 25 million over the 3G product lifecycle.

via techcrunch

Portelligent and Semiconductor Insights published a document describing interals of IPhone 3G. Techonline described the details. (Previous IPhone 3G internals photos can be viewed here)

Commuunications (3G/GSM) are on Infineon chips. One for GSM/GPRS/EDGE, another for WCDMA/HSDPA (3G). GPS module is not SiRF as we all thought. Apple uses PMB 2525 Hammerhead II. The Hammerhead II integrates an assisted-GPS (A-GPS) baseband processor with a low-noise GPS RF front end and multi-path mitigation to avoid large errors in urban environments.

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Ifixit recently published an article, describing how they had disassembeled the new IPhone 3G. Quite impressive. Especially taking into account that they bought it in New Zealand (it was 12:00 July 11 there when it was 5:00am July 10 in the US). Here are the internals:

From top left to bottom right: Display glass, LCD, Main board and EMI shield, Antenna and battery, Back panel.

George Hotz published an annotated version of IPhone's motherborad:

More IPhone's internals pictures:

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