More IPhone 3G internals photos
Commuunications (3G/GSM) are on Infineon chips. One for GSM/GPRS/EDGE, another for WCDMA/HSDPA (3G). GPS module is not SiRF as we all thought. Apple uses
For the main applications processor, Apple chose to stick with a tried-and-true Samsung ARM11-based design, with some tweaks, supported by 128 Mbytes of stacked, package-on-package, DDR SDRAM, also from Samsung. Externally, the main memory comes in two versions for the iPhone: 8 Gbytes and 16 Gbytes of NAND flash. In this case, it's 8 Gbytes, but the source was surprising: Toshiba (not Samsung as before), in the form of a single-chip device segmented into four, 2 Gbyte die (TH58NVG6D1D).
Wi-Fi chip is the
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