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Archive for September 15th, 2015


TSMC to Produce A10 Chips for iPhone 7 Alone - Rumor





According to the latest report from reliable insiders, Apple has recently assigned Taiwan Semiconductor Manufacturing Company (TSMC) as the main supplier of the A10 chip, which is expected to be used in the iPhone 7 that will come in 2016. The rumor comes from a rather reliable Asian newspaper China Times, so it’s rather trustworthy. As noted by the same sources, the next-generation iPhone processor will be built using a 16-nanometer technology and InFO architecture. The production of the chip will reportedly start next year in March.


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Written by Andrey

Tuesday, September 15th, 2015. 12:57

iPhone 6s Plus Supplies Constrained Because of Faulty Backlight Modules



According to the latest report citing Apple’s supply chain sources, the iPhone 6s Plus is currently constrained because of faulty backlight modules. As noted by usually-reliable KGI Securities analyst Ming-Chi Kuo, Japanese supplier Minebea has faced some manufacturing difficulties resulting in limited supply of the new handset. To resolve the problem, Apple is reportedly transferring orders to another supplier called Radiant, that is expected to see a 70-80% increase in orders in September. It appears that Radiant is more experienced in the production of backlight modules for large-screen devices.


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Written by Andrey

Tuesday, September 15th, 2015. 12:05

iPhone 6s 11% Heavier than iPhone 6 - Insiders



Apple’s iPhone 6s is reportedly 11% heavier than the iPhone 6, sources claim. Even though Apple is using a lighter and stronger 7000 series aluminum, because of the new 3D Touch display the weight of the device increased a bit. The display of the iPhone 6 weighs 12g and the new iPhone 6s display that features support of 3D Touch technology weighs 29g. The weight of the iPhone 6s Plus display has increased from 19g to 40g.


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Written by Andrey

Tuesday, September 15th, 2015. 11:33

Posted in All,Hardware,Other,rumors

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